What is wire bonder?
Wire bonder is an machine to work the process of providing electrical connection between the silicon chip and the external leads of the semiconductor device using very fine bonding wires.
There are three types of wire bonding:
Thermocompression Bonding,
Thermosonic Bonding,
Ultrasonic Bonding.
Sinofee separate slip ring series is a type slip ring widely used in this kind of bonders, stable and lower loss of signal transmitting.
As wire bonders have different types and functions, also, different manufacturer have different design, which, they choose different slip ring type for their bonders, Sinofee capsule slip ring series also be chosen as a part of it components.
We are so glad to share our these 2 series for all wire bonder suppliers.
If you are looking for a slip ring for your machines, welcome to contact us via rita@sinofee.com!
Thermosonic Bonding,
Ultrasonic Bonding.
Sinofee separate slip ring series is a type slip ring widely used in this kind of bonders, stable and lower loss of signal transmitting.
As wire bonders have different types and functions, also, different manufacturer have different design, which, they choose different slip ring type for their bonders, Sinofee capsule slip ring series also be chosen as a part of it components.
We are so glad to share our these 2 series for all wire bonder suppliers.
If you are looking for a slip ring for your machines, welcome to contact us via rita@sinofee.com!